A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology

Fan-out wafer level package with silicon substrate is attracting more and more attention because of the compatible production process. In this paper, a new embedded silicon fan-out package scheme was proposed. SiO
₂
stop layer deposited by PECVD and 355 nm laser releasable temporary bonding technology were applied to solve silicon etching uniformity, footing and grass issues. With 12% over-etching, there is no footing and grass found after silicon cavity etching through optical microscopy and SEM inspections. The new scheme can achieve thinner package and better heat dissipation performance owing to introducing of temporary bonding.