Manufacturing Challenges and Cost Evaluation of New Generation 3D Memories

This work gives an overview of the evolution of manufacturing techniques of 3D-NAND Non-Volatile Memories (NVMs). It evaluates manufacturing challenges that directly impact manufacturing cost of memories. Included is physical analysis shown by SEM Images. The work outlines complexity of manufacturing process and consequences of adding word lines. Critical steps in the process like deposition of layers, high aspect ratio etching, and staircase formation are evaluated and their impact on wafer manufacturing cost. A proprietary software is used to simulate the fabrication steps and calculates Front-End manufacturing cost. Additional word lines increase the cost of wafer manufacture, but the cost of each Gigabit is reduced.