Reliability tests for thermal aging of thin-film AlCu metallizations

The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an automatic measurement system, previously designed and implemented Reliability tests have been performed at 150/spl deg/C and 220/spl deg/C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible.