Dual operational amplifier using flip-chip fine package of 1.0/spl times/1.0/spl times/0.6-mm with 8-pin counts

This 1.0/spl times/1.0/spl times/0.6-mm flip-chip fine package has a 0.35-mm pin pitch and 8-pin counts in which a dual operational amplifier (0.83/spl times/0.78/spl times/0.2-mm Si IC) is fabricated. The 91.4/spl times/58.1/spl times/0.2-mm arrayed ceramic substrate contains 2816 1.0/spl times/1.0-mm packages that are made by a flip-chip bond process. Chip-coat process executes underfill and overcoat processes simultaneously. Mount area of the FFP is only 4.4% the area of a shrink small outline package with 8-pin counts. The reliability of the FFP is almost same as that of the conventional resin mold package.