Research on Temperature Aging Life Equivalent Test Method of Press-Pack IGBTs Device Used in Circuit Breaker

Press-pack IGBTs (PPI) are used in the flexible high voltage direct current (HVDC) converter valve and the direct current circuit breaker (DCCB). At present, the life research for PPI used in DCCB is still immature, and there is a lack of equivalent life test methods based on laboratory high-temperature accelerated aging tests. In this paper, simulation calculation method is used to study the chip temperature change of PPI when it switches off great short-circuit current. The change of the maximum temperature of the chip is obtained. Based on the results, the fitting curves of the chip temperature and the current maximum at different current durations are drawn. Combined with the life-span aging model of electronic components, an equivalent experiment method for calculating chip life using a fitted curve is proposed.