The comparison of solder joint reliability between BCC++ and QFN

Since two leadless packages, BCC++ and QFN, are getting popular in the application of communication and consumer products, an attempt is made to compare the board level reliability between the two packages. Mechanical and fatigue tests are both used to evaluate the strength of their solder joints. Mechanical tests include shear and bend-to-fail of the joints. Their resistance to fatigue is evaluated through thermal cycling, cyclic bending and repetitive drop tests. The results from shear, bend-to-fail and drop tests are reported in this work, their associated failure modes are also discussed. The result of cyclic thermal and bending tests will be reported when it becomes available.