Ultra thin electronics for space applications

Higher performance, increasing I/O requirements and smaller chip size are putting more demands on technology for increased density. If most of the demand is coming from consumer electronics for next generation of Internet portable devices, similar trends are seen in the space industry with the future generation of broadband multimedia satellite payloads. A new patented packaging technology for highly complex digital application is presented in this paper. 3D interconnect of ultra-thin silicon die (15 /spl mu/m thick) is enabled through slightly modified MCM-D technology. Collective fabrication is done with specifications which could respond to space environment standards. We review the key enabling technologies used to fabricate an ultra compact channelizer composed of 3 cascaded, 496 I/O ASICs. The 3D module has a footprint of 25/spl times/25 mm/sup 2/ with overall thickness of 500 /spl mu/m which makes it compatible of any chip scale package that will allow thermal management for 7.8 W power dissipation.