Full wave analysis of planar interconnect structures using FDTD-SPICE

This paper describes a full wave approach for analyzing planar interconnect structures, such as power distribution systems in printed circuit boards and multichip modules, using a tightly coupled combination of FDTD and SPICE. The technique enhances the present hybrid full wave circuit methods in terms of robustness and efficiency. The method is applied to a few sample problems to illustrate its accuracy and versatility.