Design method for high reliable flip chip BGA package

An efficient design method for flip chip ball grid array (BGA) packages has been developed. This method uses design of experiment (DOE), a series of finite element (FE) stress analyses based on an orthogonal array used in DOE, and statistical analysis. By using this method to design a BGA package having 1600 pins, the warpage of the optimum packaging structure is very small and all of the reliability demands are satisfied.