Temperature-dependent Electrical and Thermal Characteristics of tpPI/h-BN Composite Insulating Material Using Electrostatic Adsorption Method

The composite material with both a higher thermal conductivity and acceptable breakdown strength has been developed to reduce the cost and thermal conductive plate thickness. To develop a thermal conductive composite insulating material, thermoplastic polyimide (tpPI)/ hexagonal boron nitride (h-BN) composite were produced by an electrostatic adsorption method, and the breakdown strength (Fb) and the thermal conductivity of the composite were measured at high temperature. The Fb under the impulse voltage application showed a constant value regardless of the measurement temperature. The thermal conductivity of the tpPI/h-BN composite at 393 K was higher than that at 303 K. The thermal property of tpPI led to the temperate dependent thermal conductivity of the composite. The fabricated tpPI/h-BN composites showed excellent electrical and thermal properties even at high temperatures.