Multiphysics Condition Monitoring Technique for Reliability Assessment of Wide Bandgap-Based Power Modules in Electric Vehicle Application

Comprehensive and accurate reliability assessment can address the existing design challenges in using wide bandgap-based semiconductor technology in new power electronic applications such as electric vehicles. Condition monitoring technique is a common approach for evaluating switch health by analyzing the changing trend of some specific switch parameters. Due to the basic differences between wide bandgap-based and silicon-based power modules, applying the existing condition monitoring approaches does not lead to the expected accuracy in circuits using wide bandgap devices. Considering the existing limitations in electrical parameters-based condition monitoring approaches, a multiphysics condition monitoring technique is proposed in this paper. Complete profiles of switch operational parameters have been employed in an iterative process in order to obtain junction temperature of the switch as the main failure indicator. The effect of thermal, electrical, and magnetic physics are considered to have a more accurate junction temperature assessment. Weibull-Arrhenius lifetime model is employed to assess the switch lifetime based on the real-time switch parameters. The proposed multiphysics condition monitoring approach is simulated for a case study of electric vehicle application (Toyota Prius 2010 DC/DC converter system). In the developed simulation platform, COMSOL, PLECS, and MATLAB are employed as the thermal and magnetic analyzer, circuit analyzer, and reliability assessment center respectively.