Failure analysis technology based on OBIRCH

With the continuous development of manufacturing technology, the integration and accuracy of integrated circuits are getting higher and higher, and the requirements of fault analysis technology are also getting higher and higher. In the past, the traditional failure analysis technologies could not meet the requirements until the emergence of OBIRCH (Optical Beam Induced Resistance Change) failure location technology. OBIRCH technology can accurately locate the failure of the IC, and establish the connection between the failure point and the electrical characteristics. This article will introduce the basic equipment and principle of OBIRCH technology, and show the great role of this technology in integrated circuit failure analysis technology through several actual failure analysis cases.