Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads

In this study, the effect of current density on tensile performance of Cu/Sn-58Bi/Cu joints under electrothermo-mechanical (ETM) coupled loads was researched. The results indicate that the tensile strength of the joint under ETM coupled loads was much lower than that under tensile stress without electric current stressing at 25 °C. Moreover, the joint's stiffness and tensile strength continuously decreases with increasing current density. Furthermore, the fracture position is transferred from solder matrix to the solder/IMC layer interface with a fracture mechanism transition from ductile fracture to ductile-brittle mixed one.