Characterizing Microwave Connectors over Temperatures Using Thermal-stable Standards

This paper presents an effective method to characterize microwave connectors over a range of temperatures (-30 - 100°C), which can be useful to the accurate thermal characterization of devices or materials. First, to address the challenges of de-embedding over temperatures, the de-embedding standards are made of thermal-stable RF laminate, allowing for the assumption of constant standard properties over temperatures; all the standards are measured concurrently with a 4-port VNA for each temperature of interest, ensuring little error induced by temperature difference. Second, de-embedding methods TO, TS, TSO, and TD are found fit for the above setup. Based on a linear and generalized formulation, a comprehensive analysis of the error sensitivity and standard design is performed. Last, based on the above knowledge, SMA connector (Radiall #R125-541-000) is characterized with good preliminary results, demonstrating the effectiveness of the proposed method.