Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

The past few years have seen increasing interest in advanced package architectures as compact, high performance platforms for heterogeneous integration across a wide variety of applications. Interest in advanced packaging is driven by the need for increased on-package bandwidth, the need to integrate diverse IP from multiple foundries and the need for improved yield resiliency . A number of innovative package architectures that enable power-efficient on-package bandwidth interconnects have made major advances in microelectronics performance possible . Focus on heterogeneous integration makes visible to broader audiences, the packaging community that in a quiet, systematic and largely unheralded manner continues to drive momentous changes in packaging, assembly and associated test technologies. In this paper, I will attempt to describe some of these changes and more importantly offer a perspective for how packaging should evolve and what this means to the thermal management community.