Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in Non-Conductive Paste (NCP) for 3DIC Packaging

A new estimation technique for interfacial reaction between amine-epoxy based resin and nano scale silica filler suspension system is developed to explain the thermal process of non-conductive paste (NCP) materials for microelectronic flip-chip packaging. Our experimental method and cure-kinetic model are proposed for the determination of the kinetic parameters which describe an autocatalytic reaction. A differential scanning calorimeter (DSC) was used to monitor and determine the interfacial and overall reaction kinetics of systems with different amount of silica filler contained. Our observation from the experiment shows that heat of reaction linearly increases as the filler density gets higher for the same base resin system. The methodology of the cure-kinetic modeling and fitting procedure were also developed, which describe the information related to initial reaction rate, interfacial reaction with fillers, conversion at vitrification, the reaction rate constants under different isothermal conditions, and characteristics of the phenomenological kinetic model with assumptions being made about the overall reaction order. By applying developed curekinetic model and parameter set reflecting interfacial reaction between nano scale filler and base resin, one can easily represent the relative cure conversion as a function of specific time, temperature and also different filler loading condition effectively.