Thermo compression bonding for large dies under protective atmosphere

In bond pitch ranges of 50 to 30 micrometer Thermo Compression Bonding (TCB) is an established bonding technology for example for high bandwidth memory (HBM) using relative small dies. For logic, processor and interposer applications, die sizes may be much larger and bonding behavior may be more complicated due to warpage, relative high heater powers, high number of contacts and possible oxidation issues. This paper will describe bonding behavior for up to 80mm × 80mm die sizes including methods using protective/reduction gas during bonding with extreme low gas consumption and effective oxidation prevention.