Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages

The goal of this research is to demonstrate area-array remateable interconnects in 3D flex or rigid-flex packages. Remateability is achieved with clamped connections between two area-array interconnect terminations using compressible z-interconnects in an elastomer insert. Silver-elastomer adhesives are used to form the remateable contacts. Uniform load distribution is achieved with metal film inserts on either side for compressible metal contacts of low interfacial resistance. The remateable approach is demonstrated with interconnect diameter of 200 microns and can be scaled down further. This novel approach can be applied to interconnect the distributed electronics in wearable, textile and implantable smart systems.