Solid State Bonding Method Based on Cu -Ni Secondary Sea Cucumber Micro-nano Layer

A solid-state bonding method based on Cu-Ni secondary sea cucumber micro nano layer is proposed. The surfaces of the two substrates with a sea cucumber Cu-Ni micro nano layer are contacted with each other to form a contact area, and then pressure is applied to the contact area under heating conditions to bond. The sea cucumber Cu-Ni micro nano layer includes a copper needle layer and a nickel needle layer plated on the surface of the copper needle layer. The copper needle layer is an array layer formed by a tapered copper microneedle, and the nickel needle layer includes an array layer formed by a tapered nickel nanoneedle and a protuberance. The microstructure, bonding mechanism and shear strength of the interface were analyzed by scanning electron microscope, transmission electron microscope and welding strength testing instrument. The results show that this solid state bonding method can obtain high strength interconnection force.