Interconnection of Terminals on Flexible Substrates it Printed Conductie Patterns

This paper presents research focused on realisation and the testing of wire to Ag printed pad interconnections realised on flexible substrates. The research was concentrated mainly on the development of highly reliable resistance spot welded interconnection technology. The mechanically crimped contacts on the same test patterns were also realised for the comparison purposes. Realised interconnections were deeply tested in terms of 4-wire contact resistance measurement before, during and after climatic ageing. Two different flexible substrates and three wire finish metals (Cu, Sn, Ag) were used for the resistance spot welding process. The changes of test samples contact resistance during the dry heat test and damp heat test are described in the paper. It can be concluded that the resistance spot welding process can produce high reliable interconnections between wires and Ag printed terminals on flexible substrates. This technology is scalable to mass production, is low cost and properties of realised interconnections are comparable to conventional crimped interconnections.