Thermography investigation of soldered joints for LED mounting

Passive thermography method was used to investigate the heat sink efficiency for non-traditional soldered joints. Quality testing of soldered samples was conducted, specifically ones soldered using reactive soldering technique that provides the local heating of surfaces of the joint generated as a result of self-propagating high-temperature synthesis reaction in multilayer nano-foils. It is shown that the poorly soldered or damaged areas of tested joints are adequately visualized as areas of uneven heating when the current passes through the sample. It was revealed that reactive soldering with multilayer nano-foils can be considered the suitable method for mounting light emitting diods onto the printed circuit board