Evaluation of Electronic Components Overheating on Printed Circuit Boards

The article presents the results of development of a simple engineering tool for automated calculation of electronic components overheating at the stage of printed units design. Transferring the basic equations of heat exchange to polar coordinates provided to present them as Bessel equations, the solution of which allowed obtaining fairly simple mathematical dependencies using modified Bessel functions of the first and second kind to find the overheating of any electronic component on the board. The overheating value calculator based on these dependencies has been implemented in Microsoft Excel. The results of the computations were analyzed to identify the effect of design parameters on the components overheating and give recommendations on its reduction.