Loading [a11y]/accessibility-menu.js
A 0.57-mW/Gbps, 2ch × 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-µm LD-Array-on-Si | IEEE Conference Publication | IEEE Xplore

A 0.57-mW/Gbps, 2ch × 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-µm LD-Array-on-Si


Abstract:

A low-power 2-channel PAM4 transmitter front-end consisting of 65-nm CMOS PAM4 shunt LD drivers and flip-chip-bonded 1.3-μm LD-array-on-Si achieves simultaneous 2ch × 53-...Show More

Abstract:

A low-power 2-channel PAM4 transmitter front-end consisting of 65-nm CMOS PAM4 shunt LD drivers and flip-chip-bonded 1.3-μm LD-array-on-Si achieves simultaneous 2ch × 53-Gps PAM4 transmission over 2-km-long SSMF with power efficiency of 0.57 mW/Gbps.
Date of Conference: 08-12 March 2020
Date Added to IEEE Xplore: 04 May 2020
ISBN Information:
Conference Location: San Diego, CA, USA

Contact IEEE to Subscribe

References

References is not available for this document.