LQFP Warpage Optimization Based on Variance Analysis Method

In order to analyze the warpage of package products during the process of post-molding, the simulation of a kind of low-profile quad flat (LQFP) was carried out. With the mechanical module in ANSYS workbench, the influence of epoxy molding compounds (EMC), chip and leadframe (LF) thickness on warpage are studied. The simulation results show that when the thickness of EMC is increased, the warpage of LQFP is reduced. While the thickness of the chip or the leadframe increased, its warpage become worse. Moreover, variance analysis shows that the thickness of EMC, chip and leadframe affect warpage in a descending order. The work can provide an effective reference for reducing the warpage when designing similar products.