Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding

Laser-assisted glass frit bonding as a noncontact thermal bonding method has been widely applied in the organic light-emitting diodes (OLEDs) encapsulation field. However, blue light emitting from the OLEDs devices could cause many hazards. Therefore, it is of significance to develop a high reliable packaging technology with blue light-shielding performance for OLEDs. In this work, a BiVO
₄
thin film capable of shielding blue radiation applied in glass frit laser encapsulation were developed. BiVO
₄
thin films were deposited on glass by chemical solution deposition process. The effect of annealing temperature ranging from 573 to 873K on blue light-blocking performance has been investigated. The optimized BiVO
₄
films exhibited the best blue light-shielding capability and could block 50.32 % short wavelength blue light (400 - 450 nm), while maintaining greater than 87 % average transmittance in the wavelength range of 500 - 800 nm. Finally, the laser-assisted glass frit bonding device combined with optimized BiVO
₄
blue light-shielding film has been fabricated. Therefore, transparent BiVO
₄
film with high blue light-shielding efficiency are desirable for practical encapsulation applications.