Research on Vibration Reliability of System in Package

With the development of packaging towards smaller, lighter and more versatile, the reliability problem caused by vibration load becomes more and more serious. In this paper, a three-dimensional finite element model of a SiP product was established by using ANSYS software to study the reliability of the SiP under random vibration. The eight holes of PCB were fully constrained and the first four frequencies and mode shapes of the SiP were obtained by modal analysis. Compared with the experimental results, the accuracy of the model was verified. According to the national military standard GJB548B-2005 method 2026.1, test condition 1, the numbered D load, random vibration analysis was carried outunder different directions with acceleration power spectral density of 10g
²
/Hz and acceleration total root mean square value of 119.5 m/s
²
. The stress distribution and response prediction of the SiP were obtained.