Thermal Performance Analysis for Multiple Heat Source Power Devices

In this paper, the thermal performance analysis and optimization of the package of a specific multi-heat source power device is carried out. Firstly, the finite element analysis software ANSYS Icepak is used as a tool to build a simplified model of the array type multi-power device package module. Secondly, the impact of five variable parameters on thermal performance of multi-heat source power devices is analyzed. These parameters are chip size, chip power consumption, die attach material, packaging material, package size. Finally, through the orthogonal test analysis method, the junction temperature and thermal resistance of the package are selected as the test indexes, and five parameters are selected as the orthogonal test factors to analyze the influence of the five parameters on the thermal performance. The results show that the thermal conductivity of the die attach material is most significant regardless of the package junction temperature or thermal resistance. By summarizing the influence of various factors on the thermal performance of power devices, the suggestions for optimizing the thermal performance of multi-heat source power devices are proposed. The results obtained have important guiding significance for the thermal performance optimization of power devices.