Three-dimensional analysis of an enhanced cooling system for electronic packaging

This study investigates the maximum heat flux and its corresponding superheat temperature for a straight pin fin in a boiling FC-72. Investigations are carried out numerically under atmospheric pressure by solving a three dimensional heat conduction equation in steady state. The finite element method (FEM) is used to investigate this phenomenon. The numerical results are in good agreement with available experimental results. One-dimensional analysis of boiling on a straight pin fin had been carried out. Therefore, comparison is made between the one and three-dimensional analysis results. The effect of length and diameter on the maximum heat flux (MHF) and the operational stability are also investigated.