3D AiP for Power Transfer, Sensor Nodes, and IoT Applications

The most important characteristic of an antenna, especially when integrated solutions for mass production are of interest, is the physical limit imposed on the antenna dimensions. A miniaturized antenna with the highest performance and integration capacity is in high demand. Antenna‐in‐package (AiP) solutions are good candidates to achieve this goal and they find use in various wireless systems such as Internet of Things (IoT) devices, radio‐frequency identification (RFID) tags, sensor nodes, radio telemetries, and wireless power transfer (WPT) devices. Multi‐mode antennas cover wider impedance bandwidth than single‐mode antennas and can show a frequency bandwidth that exceeds the corresponding bandwidth of the lower bounds. Implementation and integration of the antenna is an important issue in the cost and size reduction of WPT and energy harvesting systems. PCB technology can be used to implement a cost‐effective 3D AiP solution for wireless communication systems such as sensor nodes and IoT devices.