Research of thick film copper circuit in microelectronic packaging

Thick film copper circuits are a critical technology in microelectronic packaging. This paper emphasizes low temperature glass ceramics cofired with copper. Difficulties with LTCC/Cu packaging include organic removal and copper circuit protection. In different sintering techniques, by careful control of the oxygen partial pressure, the quality of the multilayer copper system can be ensured. Differential shrinkage characteristics of copper thick film and LTCC sheet result in delamination cracks and camber in the final products. Sintering promoters have an important effect on the conductivity and adhesion strength of copper thick film. The final structure of the sintered thick film appeared as a three-dimensional net.