Advanced VSCEL Package for 3D Sensor Application by Using Attached Ceramic Spacer Technology

Vertical cavity surface emitting laser (VSCEL) is one of the fastest growing market segments of semiconductor. The advantages of VSCEL are including higher coherent, symmetrical and lower divergent optical beam, and its major applications include Datacom, commercial lasers, and 3D sensing etc.. Recently, the 3D sensor application becomes the most popular topic because the face ID applies for sensing identification in mobile phone. The application of the highly growing mobile phone market is driving force to push the industry to develop the 3D sensing identifiable application. However, with the increasing of 3D sensor application, developing the well-fitting sensor package for VSCEL is necessary and urgent. In this paper, an advanced process and package design are introduced for VSCEL component by integrating the Direct Plated Copper (DPC) on ceramic substrate, ceramic spacer, VSCEL die/wire bonding and also glass lids attached technologies. This new ceramic-based package provides not only outstanding heat dissipation function but also the robust package structure for VSCEL application.