Mechanical properties of the low-k material measured by tensile tests

Low-k materials are widely used in the IC (Integrate Circuit) integration, which weaken mechanical properties are critical in packaging reliability designs. In this study, the thin film of low-k material was fabricated, patterned and marked by the tiny ink dots for measuring its mechanical properties by uniaxial tensile tests. The method improves test accuracy by avoiding errors from samples ends and clamps in tensile test. The Young's module, Poisson's ratio and fracture toughness of the low-k material are obtained by the method.