Application of Ultrathin Organic Insulating Films for Electronic Package

A insulation layer can provide separation between the different electrical signals in electronic package. Herein, poly(methacrylimide) (PMI) and poly(methylacrylic acid) (PMAA) initiate by 4-Nitrobenzene diazonium (NBD) tetrafluoroborate are grafted on 4-inch silicon wafer. O2 plasma is applied to improve adhesion property. Peeling experiment shows the treatment exhibited a better adhesion property with metals than no plasma treatment. X-ray photoelectron spectroscopy is used to determine the position of adhesion break point and analyze changes in surface composition. The mechanism of effect of O2 plasma is discussed. Nanostructure and surface composition are supposed the key point of plasma modification mechanism.