Strip Warpage Evaluation after FCB and Molding Procedure

FCCSP (Flip Chip Chip Scale Package) is widely used in current electronic products, such as: mobile devices. Although it's a mature technology package type so far, it still need to overcome strip warpage issue after die bonded and molding procedures. The most challenge is strip warpage behavior always performed convex on short edge after die bonded process. This behavior is odd with normal situation since CTE mismatch might induce deformation on long edge. It induced multi-issues and need more man power instead of automation on next procedure. Hence, this study focused on investigating constraint condition during flip chip bond process to affect strip deformation. Moreover, we adopted aMA (Advanced Metrology Analyzer) to figure out the strip deformation behavior and EMC (Epoxy Molding Compound) shrinkage volume and then realized in mechanical simulation model. Consequently, this study would suggest the optimal design to improve the overall strip warpage and advise the appropriate EMC properties to pass manufacture limitation.