Release Sheet Integrated Backside Coating Tape Corresponding to Stealth Dicing

In flip chip mounting process, chip is fragile since chip is not protected by mold resin. It is known that the backside coating tape has been used widely to correspond to blade dicing. We had developed a release sheet integrated backside coating tape corresponding to blade dicing for a thin wafer. On the other hand, stealth dicing becomes popular to prevent chipping. In this study, we investigate the process of release sheet integrated backside coating tape corresponding to stealth dicing. we evaluate process consisting of stealth dicing, mount, laser marking, cool expanding, heat shrinking, heat curing and pick up. As a result, it is found that it is possible to manufacture a chip with backside coating layer in lower height expanding by optimization of the base film material of release sheet and expanding condition.