New Approaches in ESD Risk Measurement of PCB Assembling Machines and ESD Countermeasures

The ESD risk evaluation of automated PCB (printed circuit boards) assembly machines became extremely difficult in the last years: Accelerated process speeds and limited access to critical positions made direct measurements impossible. A new test board with a contactless voltage probe attached is presented, providing precise in-situ measurement of electrostatic charging of the PCB. Surprising results were achieved, opening a new view on different ESD charging and discharging scenarios during the component placement process. In conclusion of these measurements, also new ESD protection approaches have to be considered, which avoid friction electricity between the nozzle and components to be placed.