Integrating NI LabVIEW in Soft Defect Localization of Temperature Dependent Voltage Failure

One of the challenges in the field of failure analysis is the effective failure characterization and fault isolation of devices which only fail on specified region of temperature, frequency, and voltage. Soft defect localization is used for the failure localization of such cases. In this paper, a LabVIEW program was utilized and developed for failure characterization and localization to help in the soft defect localization of two devices with output voltage temperature dependency failure during hot and cold temperatures. Moreover, the Dynamic Analysis by Laser Stimulation (DALS) capability of Hamamatsu iPhemos was utilized in performing the soft defect localization process.