Fill Factor Loss in Fielded Photovoltaic Modules Due to Metallization Failures, Characterized by Luminescence and Thermal Imaging

Understanding the causes of photovoltaic module failure in the field can be achieved using spatially-resolved imaging tools in combination with current-voltage (IV) characterization. We evaluate 23 field-degraded modules by comparing their IV characteristics with module images obtained by electroluminescence, photoluminescence, UV-fluorescence, and dark lock-in thermography. We identify primarily metallization failures (metallization series resistance, solder point heating, broken fingers, disrupted interconnects) in these modules that has led to a severe drop in the fill factor and up to 35% power loss over only 2 years of deployment.