Development of a millimeter wave system-on-a-package utilizing MCM integration

We present the development of integral passive components in a multilayer polyimide MCM technology that is suitable for developing a millimeter wave system-on-a-package. For the first time, we demonstrate the direct integration of a Wilkinson power divider/combiner circuit onto a Kapton based multilayer flex interconnect using integral Ta/sub 2/N thin-film resistors. The integral Wilkinson power divider/combiner achieves a measured insertion loss of less than 0.5 dB at V-band (60 GHz). In this paper, we also present results on the integration of a power combining subsystem with MMICs to develop a system-on-a-package at 60 GHz.