Electrical package characterization using differential TDR techniques

Summary form only given. TDR has been extensively used for characterization of electronic packaging, and a number of papers have been published on the subject. Single-ended TDR modeling techniques have been described in detail in Tektronix Application Note 85W-8885-0 (1993) and standardized in JEDEC Publication no. 123 (JC-15 Committee, 1995). In this paper, we discuss the differential TDR package modeling techniques in more detail, and their advantages and problems are analyzed. The spectrum of package modeling problems, best tackled with a differential TDR, is outlined.