A novel DAF Solo Mount Method for SDBG Process

SDBG (Stealth Dicing Before Grinding) process is known as an effective process for thin chips. In SDBG process, DAF (Die Attach Film) is used for 3D chips stacking package. Conventionally, DAF and wafer are mounted on a ringframe at the same time by a pressing roller. However, the pressing force tend to be unequal to the whole wafer, which causes uneven kerf width after BG tape peeling. In this study, we inspected a novel DAF mount method called “DAF solo mount method”, and this method gives more balanced pressing force to DAF. Thus, this method can keep even kerfwidth after BG tape peeling compared to the conventional method.