Hermetic and Radiation Tolerant Glass Package for VCSELs Using Novel Micro Bonding Method

In this study, we use novel glass micro bonding method to manufacture hermetic and radiation tolerant all-in-glass packages for vertical cavity surface emitting lasers (VCSEL) suitable for space applications. Thermal analysis demonstrates that the properties of the designed Leadless Glass Package (LGP) are well-suited for the intended conditions, even at higher temperatures than required. Evaluation tests show excellent device functionality and robust package structure. The same design could easily be adapted to other glass types, such as Borofloat 33, and end applications such as MEMS and active implants. The assembly design and technologies are well-suited for commercial volume scale manufacturing.