Evaluation Method of Electronic Performance Margins for Sip Based on Field-Circuit and Multiple Physical Cooperative Simulation

Owing to advantages, such as multi-function and high integration, etc, system in package(SiP) is more and more popular in the electronic industry. But when designing a SiP product, it also put forward higher requirements to design for reliability, environmental adaptability, for example. Among them, the primary consideration is the more accurate margin analysis of electrical performance in different working environments. Electrical performance evaluation is no longer a simple link simulation. It needs to consider the impact of internal and external working environment including the electromagnetic(EM), thermal and mechanical field for the system which all need to be accurately considered in the electrical performance margins evaluation for the SiP. Based on the method of field-circuit and multi-physical cooperative simulation, an accurate method for evaluating the electrical performance margin of SiP is proposed this paper. In this evaluation method, we can bring many key influencing factors, such as the structure, IC & components, the material parameter fluctuation, the working environment condition, and so on. Using this collaborative simulation, we can establish different accuracy of the evaluation model of the electrical performance margin, which is suitable for the design requirements of different stages of the system. In order to validate this evaluation method, we have designed and manufactured a simplified verification model for multi-physical field simulation from a practical radar SiP product.