Laser structured passive Components and RF Filter in LTCC Technology with Operating Frequencies up to 40 GHz focusing on 5G Mobile Applications

This paper presents passive components and embedded low-pass filter (LPF) using Low Temperature Co-fired Ceramic (LTCC) materials and advanced picosecond laser structuring. These components and the LPF are well suited for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless mobile applications focusing on 5G frequency bands. The passive components were measured, working up to 40 GHz and offering good RF performances. The LPF structure, consists of these passives, achieved a measured insertion loss lower than 0.6 dB up to 20 GHz, and a return loss of less than -13 dB in the pass-band of the LPF. The 3 dB frequency was 27.4 GHz. The whole LPF occupies a substrate area of 1.3 × 0.7 × 0.09 mm
³
without probe tip ports and transitions. The LPF structures in a LTCC package suit well for 5G-band applications due to the compact dimensions and the good RF performance.