Heterogeneous Integration of Surface Mounted Devices for Bendable Electronics

Electronic devices becomes more and more mechanical flexible [1]. Additive manufacturing, e.g. printing of functional layers is one solution to build up such devices. However, for higher integration offunction it is useful to integrate traditional solid components. Heterogeneous integration of solid electronic devices on flexible foil substrates enable high productive processes, which are established very wellfor traditional solid electronics. The present work investigated in reliability of surface mounted devices. As interconnecting technology, a soldering process was used in the first step. Adhesive bonding technologies will be also investigate in the next step. With regard to rollable electronics, as already shown on CES2019 [3], an adapted test setup was designed to simulate comparable stress on the test specimen. In detail the mechanical stress also take effect to the solder junctions of the devices with this test setup. A special test specimen was designed with a variation of electronic components with regard to the size (01005, 0201, 0402) and mounting orientation. The bending test was applied with different bending radii of 5 mm and 15mm. The Weibull analysis allows to estimate lifetime of those modules. As expected the smaller the device the higher the lifetime is. The same effect was observed for a bigger bending radius, which was also expected But, with the evaluated results, it is now possible to estimate lifetime of applications in the user environment.