Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 μm thick borosilicate glass substrate, which has very low dielectric loss compared with silicon at millimeterwave frequencies. We used a microstrip line to feed the antenna, and the Yagi-Uda configuration using via structured radiator; reflectors; and director were fabricated using tungsten coated silicon via structures embedded in reflowed glass substrate with good high frequency characteristics. The proposed antenna achieved vertical polarization in planar configuration with height 0.09λo. High gain with end-fire radiation was achieved due to the Yagi-Uda configuration. Measured results confirmed the fabricated antenna operated in the W-band with 10 dB fractional bandwidth (FBW) of 12.5% from 76.3 to 86.5 GHz and peak gain of 7.82 dBi at 81 GHz in the end-fire direction. Thus, the proposed antenna with end-fire radiation will be useful for millimeter-wave onboard wireless communication, radar imaging, and tracking applications.