Experimental Study on Thermal Fatigue Life Prediction Model of PBGA Solder Joints

In the Prognostics and Health Management (PHM) technology of airborne products, the accuracy of life prediction model is very important for the life prediction. In order to acquire the proper life prediction model, the thermal fatigue life prediction model of PBGA solder joints was validated and modified by combining thermal cycle reliability experiment with finite element analysis. Firstly, during the thermal cycle reliability experiment, the resistance values of solder joints on test samples were surveyed and collected in real time, and the characteristic failure time of PBGA solder joints were obtained by Weibull probability distribution. Subsequently, the finite element analysis model of the PCB test sample was established based on the ABAQUS software, and Anand model was used to simulate the visco-plastic constitutive relationship of the solder joints, thus we can obtain the stress and strain data of the key solder joints, and the thermal fatigue life was calculated based on the Engelmaier model. Finally, the model parameters were modified by comparing the experimental results with the simulation results.