EMI Suppression With Distributed $LLC$ Resonant Converter for High-Voltage VR-on-Package

Higher on-chip current demand leads to lower power efficiency of the power delivery network due to distribution losses within the current path. A high-voltage power architecture and voltage regulator (VR)-on-package topology can increase system power efficiency by reducing distribution losses. Electromagnetic interference (EMI) can, however, be a significant challenge due to the high-voltage injection and close proximity to sensitive electronics. A novel transformer-based inductor, inductor, capacitor (LLC) resonant converter with a distributed topology for point-of-load dc-to-dc conversion is presented here. The distributed topology exhibits more than 3× lower EMI as compared with a single-branch LLC resonant converter with the same step-down ratio. A prototype of the VR-on-package has been developed. Experimental results demonstrate good correlation with the EMI analysis. Application to systems-inpackage, wireless devices, and Internet of Things is targeted due to the low EMI of this distributed converter system.