Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2019

The semiconductor industry is facing with unprecedented challenges and new innovations are on the horizon. With 7 nm technology already in production and 5 nm on track, it is an exciting time for emerging applications such as AI, 5G, and more. Increasingly, the solutions are also augmented by innovations in the back-end processes and packaging such as IP chiplet integration and heterogeneous integration.