Modeling of Temperature Distribution Induced by Thermo-Mechanical Deformation of High-Power AlInGaN LED Arrays

Thermo-mechanical deformation, thermal resistance, and lateral temperature distribution were experimentally studied for a high-power AlGaInN LED chip-on-board array at three different input powers. A fullscale CFD model of the LED assembly was developed and correlated with the temperature and average thermal resistance measurements to enable prediction of the temperature distribution on the surface of a thermally deformed LED assembly. Application of the thermal resistance partitioning approach to thermal modeling of the deformed LED assemblies was discussed. It can be useful for design engineers for estimation of the temperature distribution across the deformed LED array, at the minimum number of temperature measurements required for model calibration.